AI chip BoM 2026: HBM, CoWoS, EUV wafers and the dual hardware/software BoM
An AI accelerator's hardware bill of materials (HBM, CoWoS, EUV wafer, advanced substrates) and its software bill of materials (firmware, BSP, model/agent inventory) are now both procurement-grade artefacts, with 2024-12 China curbs on gallium, germanium and antimony still rippling through spec desk
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